PCB specification
Layer: 8L HDI
material: FR4 HTG170
Board thickness: 1.2mm
Surface finish: Immersion gold
Min through laser hole: 0.1mm(4mil)
Min line width: 0.089mm(3.5mil)
Min line space: 0.089mm(3.5mil)
Special requirements: Blind&buried microvia
RoHS Compliance
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Our Technology Support
Our company provides various lamination material,such as Rogers,Sengyi,KB... for manufacturing PCBs(HDI boards, High-frequency boards,High TG boards, Flexible, Halogen-free boards,Rigid-Flex boards...)
Fast Delivery support
2L 24hour-4days
4-8L 3days-10days
10L(up to 20L)8-18days